Super-micro-computer 5010E Instrukcja Użytkownika Pobierz pdf (Strona 44)

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SUPERSERVER 5010H/5010E Manual

2. Attaching heat sinks to the processors:

One passive heat sink has been included with your SuperServer 5010H/

5010E. Secure the heat sink to the processor with a suitable thermal

compound to best conduct the heat from the processor to the heat sink.

Make sure that you apply the compound evenly on the CPU's die,

and that good contact is made between the CPU chip (the die)

and the heat sink. Insufficient contact, inproper types of heat

sink or inproper amount of thermal compound can cause the

processor to overheat, which may crash the system. (Refer to

Figure 5-3b for Heat Sink Installation.)

4. Removing the processors:

To remove the processor from the motherboard, simply follow the

installation process in reverse order.

Figure 5-3A. FCPGA Socket: Empty and with Processor Installed

Figure 5-3b. Heat Sink Installation Procedures

1 2 ... 39 40 41 42 43 44 45 46 47 48 49 ... 127 128

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Super-micro-computer 5010E Instrukcja Użytkownika Strona 44